Plate thickness auto measurement m/c
Specialize in measuring of the Thickness of MLCC, Ceramic Chip Capacitors and Capacitor Elements
Compared to manpower, Plate thickness auto measurement m/c using Laser Alignment System and Technology of CCD Area Image Measurement to calculate the thickness of target point by computer.
The performance of accuracy, repeatability of measurement and Classification is superior than manpower, in order to help producer to effectively save time, reduce the cost of human resources, and increase production capacity.
